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The Dimensity 9400 chipset, the company's new flagship smartphone chipset geared for edge-AI apps, immersive gaming, amazing photography, and more, was introduced today.
october 10,2024

The Dimensity 9400 chipset, the company's new flagship smartphone chipset geared for edge-AI apps, immersive gaming, amazing photography, and more, was introduced today.

The Dimensity 9400 chipset, the company's new flagship smartphone chipset geared for edge-AI apps, immersive gaming, amazing photography, and more, was introduced today. Taiwanese semiconductor manufacturer MediaTek. With its second-generation All Big Core design built on Arm's v9.2 CPU architecture and the most cutting-edge GPU and NPU for extreme performance in a super power-efficient design, MediaTek's flagship mobile SoC line-up’s fourth and most recent model, the Dimensity 9400, offers a massive performance boost. The Dimensity 9400 uses MediaTek's second-generation All Big Core architecture, which combines three Cortex-X4 and four Cortex-A720 cores with an Arm Cortex-X925 core running at 3.62GHz. Compared to the Dimensity 9300, MediaTek's previous flagship chipset, this design promises 28% faster multi-core performance and 35% faster single-core performance. The Dimensity 9400, which is based on TSMC's second-generation 3nm technology, is up to 40% more power-efficient than its predecessor, giving customers greater battery life. "With on-device LoRA training and video generation, the MediaTek Dimensity 9400 will continue to advance our mission to be the enablers of AI, supporting powerful applications that anticipate users’ needs and adapt to their preferences, while also fueling generative AI technology," stated Joe Chen, President at MediaTek. "The Dimensity 9400, the fourth-generation flagship chipset, builds on MediaTek's history of providing flagship performance in the most efficient design for the best user experiences, as well as our momentum of consistent market share growth." The Dimensity 940feature0, which houses MediaTek's 8th production NPU, is the first mobile chipset to provide developer support for Agentic AI, on-device LoRA training, and high-quality on-device video production. It also boasts several industry firsts for outstanding generative AI performance. The Dimensity 9400 provides up to 80% quicker large language model (LLM) prompt performance and up to 35% higher power efficiency than the Dimensity 9300, enabling customers to benefit from the newest agentic and generative AI applications. The new Dimensity Agentic AI Engine (DAE) from MediaTek, which is intended to transform conventional AI applications into complex agentic AI applications, is also integrated into the Dimensity 9400. In order to provide a uniform interface between AI agents, third-party APKs, and models that effectively operates both edge AI and cloud services, MediaTek is collaborating with developers. A new ecosystem of agentic AI apps will be ushered in by this simplified method, which enables models to function with a wide variety of third-party APKs, cutting down on development time.

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